Method for self-aligned manufacture of contacts between intercon

Details Method for self-aligned manufacture of contacts between intercon Method for self-aligned manufacture of contacts between intercon

1989-12-18

1990-10-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 1566611, 357 67, 357 71, 437189, 437246, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049604899

ABSTRACT:
For self-aligned manufacture of contacts referred to as vias between interconnects that are contained in wiring levels arranged above one another in an integrated circuit, a pillar technique is employed where the contacts are produced before the deposition of an inter-metal dielectric to produce the pillar, a layer structure is produced that contains at least one metal layer for the lower wiring level and at least one conductive layer for the contacts. The longitudinal expanse of the contact is defined by a mask that reliably overlaps the desired width of the lower interconnect. The transversal expanse of the contact is defined by the mask needed for producing the lower interconnect. The contacts and the lower interconnects are produced by step-by-step etching.

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