Method for selectively forming small diameter holes in polyimide

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 156652, 156656, 156668, 252 792, 134 221, 134 34, B44C 122

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active

048895857

ABSTRACT:
Methods for forming small diameter holes in polyimide/Kelvar.RTM. substrates utilize hot concentrated sulfuric acid and then honing, as necessary, with liquid abradant slurries to smooth uneven edges of the openings.

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Lee and Neville, Handbook of Epoxy Resins, McGraw-Hill Book Company, 1967, pp. 22-8 to 22-65.
Markstein, "Low TCE Metals and Fibers . . . SMT Substrates", Electronic Packaging & Production, Jan. 1985, pp. 52-59.
Brooks, C. T., "Kevlar as the Reinforcing Fiber in Printed Wiring Broad Materials", p. 32.

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