Method for selectively etching integral cathode substrate and su

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566591, 156660, C23F 102, H01L 21312

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active

044419570

ABSTRACT:
In a method for preparing an integral cathode substrate and support in which selected surface portions of a formed metal part are masked, the unmasked surface portions etched, and then the mask removed, the improvement wherein the masking step is conducted by pressing surface portions of an etch-resistant, compressible sheet against the selected surface portions of the part.

REFERENCES:
patent: 3432900 (1969-03-01), Kerstetter
patent: 4155801 (1979-05-01), Provancher
RCA Technical Notes TN No. 1159, 7/1976, (Turnbull).

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