Method for selectively covering a micro machined surface

Details Method for selectively covering a micro machined surface Method for selectively covering a micro machined surface

2007-08-14

2007-08-14

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S041000, C216S047000, C216S024000, C430S313000, C438S706000, C438S710000

Reexamination Certificate

active

10527670

ABSTRACT:
On a die that has etchings on a surface, firstly a sheet of negative photoresist is laid down which, by means of an exposure and subsequent development, is left only above the etchings; then, upon the negative photoresist, a positive photoresist is applied, which is subjected to exposure and development to produce functional geometries deposited in thin film; subsequently the positive photoresist is removed in a “lift-off” operation, and the negative photoresist is taken off in a plasma operation, thus revealing the etchings.

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patent: WO 00/16105 (2000-03-01), None
Patent Abstracts of Japan, vol. 010, No. 340 (E-455), Nov. 18, 1986.
Patent Abstracts of Japan, vol. 1998, No. 11, Sep. 30, 1998.

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