Method for selective removal of organometallic and organosilicon

Details Method for selective removal of organometallic and organosilicon Method for selective removal of organometallic and organosilicon

1993-02-24

1994-06-14

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156662, 156664, 156665, 156653, 252 791, 252 792, 252 793, 252 794, H01L 2100

Patent

active

053207092

ABSTRACT:
A method for selectively removing oxidized organometallic residues, oxidized organosilicon residues, native oxides, and damaged oxides created in plasma-etching through emersion of plasma-etched silicon wafers in a solution of anhydrous ammonium fluoride and a polyhydric alcohol, which is substantially free of hydrogen fluoride and water.

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