Method for selective removal of high-k material

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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Details

C438S745000, C438S750000, C252S079100

Reexamination Certificate

active

07132370

ABSTRACT:
The present invention relates to a method for selectively removing a high-k material comprising providing a high-k material on a semiconductor substrate, and contacting the high-k material with a solution comprising HF, an organic compound, and an inorganic acid.

REFERENCES:
patent: 4087367 (1978-05-01), Rioult et al.
patent: 5271797 (1993-12-01), Kamisawa
patent: 6692976 (2004-02-01), Mirkarimi et al.
patent: 6835667 (2004-12-01), Christenson et al.
patent: 2002/0003123 (2002-01-01), Lee et al.
patent: 2003/0104706 (2003-06-01), Mitsuhashi et al.
patent: 2003/0109106 (2003-06-01), Luis et al.
patent: 2004/0067657 (2004-04-01), Perng et al.
patent: 0 968 979 (2000-01-01), None
Barnett, et al.; Solid State Phenomena, vol. 92, p. 11, 2003; “Wet Etch Enhancement of HfO2Films by Implant Processing”.
Saenger, et al.; MRS Symposium Proceedings, vol. 745 (Novel Materials and Processes for advanced CMOS, Pennsylvania, p. 79-84, 2003; “A Selective Etching Process for Chemically Inert High-k Metal Oxides”.
Christenson, et al. Solid State Phenomena, vol. 92, p. 129, 2003; “Selective Wet Etching of High-k Gate Dielectrics”.
Watanabe D. et al.,Selective Wet Etching for High-K Material by Organic Solvent Containing Hydrofluoric AcidSemiconductor Pur Water and Chemicals Conference, Feb. 17, 2003, pp. 117-130, XP008057967.
Christenson, K.Selective Wet Etching of High-K Materials, Solid State Technology Online, Jul. 3, 2003 pp. 1-7, XP002361400.
European Search Report for related European Application No. EP 04447059.9, mailed Feb. 8, 2006.

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