Method for selective etching of anitreflective coatings

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

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438756, 438757, H01L 2100

Patent

active

059814012

ABSTRACT:
The present invention relates to the fabrication of integrated circuit devices, and more particularly, to a method of etching inorganic antireflective layers without etching excessive amounts of an underlying oxide. According to one aspect of the present invention, the antireflective layer is selectively etched using an etchant which comprises about 35-40 wt. % NH.sub.4 F and about 0.9-5.0 wt. % H.sub.3 PO.sub.4 in an aqueous solution.

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