Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1998-03-13
1999-11-09
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
438756, 438757, H01L 2100
Patent
active
059814012
ABSTRACT:
The present invention relates to the fabrication of integrated circuit devices, and more particularly, to a method of etching inorganic antireflective layers without etching excessive amounts of an underlying oxide. According to one aspect of the present invention, the antireflective layer is selectively etched using an etchant which comprises about 35-40 wt. % NH.sub.4 F and about 0.9-5.0 wt. % H.sub.3 PO.sub.4 in an aqueous solution.
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Bedge Satish
Lee Whonchee
Torek Kevin James
Micro)n Technology, Inc.
Umez-Eronini Lynette T.
Utech Benjamin
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