Method for sealing semiconductor component

Details Method for sealing semiconductor component Method for sealing semiconductor component

2006-06-06

2006-06-06

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S106000, C438S110000, C438S112000, C438S725000, C438S065000, C438S264000

Reexamination Certificate

active

07056772

ABSTRACT:
In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.

REFERENCES:
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 2004/0174406 (2004-09-01), Igarashi et al.
Encyclopedia search for epoxy at www.answer.com
Epoxy Resin Handbook, Nikkan Kogyo News Paper Co., Ltd., pp. 477-484.
“Epoxy Resin Handbook,” Nikkan Kogyo Newspaper Co., Ltd., pp. 477-484.

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