Method for sealing a semiconductor device and apparatus...

Details Method for sealing a semiconductor device and apparatus... Method for sealing a semiconductor device and apparatus...

2005-07-19

2005-07-19

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000

Reexamination Certificate

active

06919222

ABSTRACT:
An apparatus includes a device chip having circuit elements fabricated on a substrate and a cap covering at least a portion of the device chip including the circuit elements such as thin film resonators. The placement of the cap on the device chip is sealed using a gasket having treaded surface for improved adhesion, cold weld deformation of gold, and decreased susceptibility to foreign particles resulting in a superior seal.

REFERENCES:
patent: 4684763 (1987-08-01), Harada
patent: 5270571 (1993-12-01), Parks et al.
patent: 6168948 (2001-01-01), Anderson et al.
patent: 6281573 (2001-08-01), Atwood et al.
patent: 2 383 192 (2002-03-01), None
patent: 9069585 (1997-03-01), None
patent: WO 03/030275 (2001-09-01), None
patent: WO 02/32203 (2001-10-01), None

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