Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-03-08
2005-03-08
Deo, Duy-Vu (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S723000, C438S725000, C438S745000
Reexamination Certificate
active
06864180
ABSTRACT:
A method for removing a dielectric layer formed upon a semiconductor substrate is disclosed. In an exemplary embodiment of the invention, the method includes subjecting the dielectric layer to a dry etch process and subjecting an adhesion promoter layer underneath the dielectric layer to a wet etch process.
REFERENCES:
patent: 5920764 (1999-07-01), Hanson et al.
patent: 6071806 (2000-06-01), Wu et al.
patent: 6114250 (2000-09-01), Ellingboe et al.
patent: 6150073 (2000-11-01), Huang
patent: 6156374 (2000-12-01), Forbes et al.
patent: 6159845 (2000-12-01), Yew et al.
patent: 6187661 (2001-02-01), Lou
patent: 6340435 (2002-01-01), Bjorkman et al.
patent: 6365228 (2002-04-01), Tsai et al.
patent: 6465159 (2002-10-01), Ni et al.
patent: 6472335 (2002-10-01), Tsai et al.
Wolf et al., Silicon Processing for the VLSI Era, 1986, vol. 1, pp. 532-534.*
E.O. Shaffer II, “Fracture Mechanics of Thin Film Dielectrics,” Sep. 2000.
E.O. Shaffer II, K.E. Howard, M.E. Mills, and P.H. Townsend, “On the Mechanical Integrity of Ultra-Low Dielectric Constant Materials for Use in BEOL Structures,” Apr. 25, 2000, pp. 1-24.
“SiLK* Semiconductor Dielectric Resins: The SiLK Story,” The Dow Chemical Company 1995-2000, http://www.dow.com.
“SiLK* Semiconductor Dielectric Resins: Products—Products Families” The Dow Chemical Company 1995-2000, http://www.dow.com/silk/products/index.htm.
“SiLK* Semiconductor Dielectric Resins: Products—SiLK I Semiconductor Dielectric” The Dow Chemical Company 1995-2000, http://www.dow.com/silk/products/silki.htm.
SiLK* I Semiconductor Dielectric, Dow Chemical Company.
Material Safety Data Sheet for XU 35114 Series of Developmental SiLK* I Semiconductor Dielectrics, pp. 1-9.
SiLK H Semiconductor Dielectric, Dow Chemical Company.
Material Safety Data Sheet for XU 35116 Series of Developmental SiLK* H Semiconductor Dielectrics, pp. 1-9.
AP4000 Adhesion Promoter, Dow Chemical Company.
Material Safety Data Sheet for XU 35117.00 Developmental Adhesion Promoter AP4000, pp. 1-8.
Bennett Delores
Fitzsimmons John A.
Fritche John
Hedrick Jeffrey C.
Liu Chih-Chien
Cantor & Colburn LLP
Deo Duy-Vu
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