Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Removal of imaged layers
Reexamination Certificate
2005-08-16
2005-08-16
Duda, Kathleen (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Removal of imaged layers
C430S322000, C134S001300
Reexamination Certificate
active
06929901
ABSTRACT:
A method of removing resinous organic material over a semiconductor process surface including providing a semiconductor wafer having a process surface comprising a resinous organic material; and, exposing the process surface to a supercritical CO2containing medium further comprising at least a first solvent for a predetermined period to produce a substantially resinous organic material free and undamaged process surface.
REFERENCES:
patent: 6737225 (2004-05-01), Miller
patent: 2004/0050406 (2004-03-01), Sehgal
Lin Chun-Hsien
Lui Ai-Sen
Duda Kathleen
Taiwan Semiconductor Manufacturing Co. Ltd.
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