Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-10-15
1999-04-27
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438 4, 438 15, H01L 2144
Patent
active
058973346
ABSTRACT:
A method for reproducing a PCB strip for semiconductor packages, wherein a poor quality PCB unit included in the PCB strip is replaced with a normal quality one, thereby achieving a reduction in the amount of package materials used and an improvement in the process efficiency. The invention also provides a method for fabricating semiconductor packages using the PCB strip reproduction method. A desired portion of a poor quality PCB unit included in a PCB strip is cut out in such a manner that a cutting opening having a peripheral edge extending along the singulation line of the poor quality PCB unit or along a region defined between the singulation line and anti-bending slots of the poor quality PCB unit. In the cutting opening, a separate good quality PCB unit member having the same shape and size as the cutting opening is then fitted. Thus, it is possible to simply and efficiently replace PCB units determined to be of poor quality with separate good quality PCB unit members, respectively.
REFERENCES:
patent: 4830985 (1989-05-01), Araghi et al.
patent: 5137836 (1992-08-01), Lam
patent: 5149662 (1992-09-01), Eichelberger
patent: 5563076 (1996-10-01), Takahashi
patent: 5700697 (1997-12-01), Dlugokecki
Ha Sun Ho
Han Byung Joon
Heo Young Wook
Amkor Technology Inc.
Anam Semiconductor Inc.
MacDonald Thomas S.
Picardat Kevin M.
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