Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1977-10-26
1979-07-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156151, 156632, 156645, 156665, 156902, C03C 1500, C03C 2506
Patent
active
041629329
ABSTRACT:
A method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy and applying a water-jet stream to said resin smear to remove it from said laminate.
REFERENCES:
patent: 3276106 (1966-10-01), Bester et al.
patent: 3568296 (1971-03-01), Cutillo et al.
Perstorp AB
Powell William A.
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