Method for removing photoresist and other adherent materials fro

Details Method for removing photoresist and other adherent materials fro Method for removing photoresist and other adherent materials fro

1992-02-26

1993-04-13

Morris, Theodore

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

134 26, 134 30, 134 31, 134 37, B08B 300, B08B 500, B08B 700

Patent

active

052019608

ABSTRACT:
A method for removing adherent matrices, such as highly cross-linked photoresist layers, from substrates, such as semiconductor wafers, comprises exposing the matrix to a vapor phase solvent and allowing the solvent to penetrate the matrix. After penetration, the vapor is condensed and then revaporized in order to promote fragmentation of the matrix and facilitate removal. Optionally, the matrix may be treated with a pre-swelling solvent and the resulting fragments removed by washing with a liquid or vapor solvent for the fragmented matrix material.

REFERENCES:
patent: 3957531 (1976-05-01), Tipping et al.
patent: 3969196 (1976-07-01), Zosel
patent: 4303454 (1981-12-01), Petterson et al.
patent: 4349415 (1982-09-01), De Filippi et al.
patent: 4695327 (1987-09-01), Grebinski
patent: 4778536 (1988-10-01), Grebinski
patent: 4867799 (1989-09-01), Grebinski

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