Method for removing material from a semiconductor wafer

Details Method for removing material from a semiconductor wafer Method for removing material from a semiconductor wafer

2006-09-19

2006-09-19

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000, C451S287000

Reexamination Certificate

active

07108583

ABSTRACT:
The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor wafer and being positioned in such a way that an axial center of the semiconductor wafer passes into a working range of the grinding wheel, the grinding wheel being moved in the direction of the semiconductor wafer at an infeed rate, with the result that grinding wheel and semiconductor wafer are advanced toward one another while the semiconductor wafer and grinding wheel are rotating about parallel axes, so that a surface of the semiconductor wafer is ground, with the grinding wheel being moved back at a return rate after a defined amount of material has been removed, wherein the grinding wheel and semiconductor wafer are advanced toward one another by a distance of 0.03–0.5 μm during one revolution of the semiconductor wafer.

REFERENCES:
patent: 3905162 (1975-09-01), Lawrence et al.
patent: 4663890 (1987-05-01), Brandt
patent: 5400548 (1995-03-01), Huber et al.
patent: 5679212 (1997-10-01), Kato et al.
patent: 6406357 (2002-06-01), Kazui et al.
patent: 6419564 (2002-07-01), Herrman et al.
patent: 6752694 (2004-06-01), Schneegans et al.
patent: 2002/0160691 (2002-10-01), Ishikawa et al.
patent: 1004399 (2000-05-01), None
patent: 0955126 (2002-10-01), None

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