Method for removing glass support from semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156633, 156644, 156651, 156657, 1566611, 156663, 156345, 252 793, B44C 122, C03C 1500, C03C 2506

Patent

active

045855137

ABSTRACT:
A CCD imager includes a thin semiconductor substrate having a glass support mounted in a recess in a housing with a portion of the glass support being exposed through a window opening in the bottom of the housing recess. A portion of the glass support is removed by securing a glass backing plate to the other surface of the silicon substrate, filling the housing recess with an epoxy material and applying a layer of an epoxy over the filling material and the backing plate. An etch resistance masking tape is placed across the center portion of the exposed surface of the glass support leaving the portions of the glass support at the corners of the housing opening exposed. The exposed portions of the glass support at the corners of the housing opening are pre-etched with a suitable etchant. The masking material is removed from the center portion of the glass support surface and the remaining portion of the glass support exposed through the housing opening is etched away to expose the surface of the silicon substrate.

REFERENCES:
patent: 3701705 (1972-10-01), Hetrich
patent: 4198263 (1980-04-01), Matsuda
patent: 4251909 (1981-02-01), Hoeberechts
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4465549 (1984-08-01), Ritzman

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