Method for removing an ion-implanted organic resin layer during

Details Method for removing an ion-implanted organic resin layer during Method for removing an ion-implanted organic resin layer during

1988-09-13

1989-08-29

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 11, 437 37, 437 20, 148DIG83, H01L 2100, H01L 2102, H01L 2130, H01L 2120

Patent

active

048617326

ABSTRACT:
In the present invention, a method for removing an organic resin material layer reduces residual substances upon removing an ion-implanted organic resin material layer. Inorganic contaminants adhered to the surface of organic resin material layer during ion-implantation are removed by etching, and thereafter, the layer is decomposed and removed by plasma irradiation of the organic resin material layer. An alkaline etchant is used for etching off inorganic contaminants.

REFERENCES:
patent: 4679308 (1987-07-01), Finn et al.

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