Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2005-10-25
2005-10-25
Goudreau, George A. (Department: 1763)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C216S013000, C216S027000, C216S040000, C216S056000, C216S092000, C438S048000
Reexamination Certificate
active
06958123
ABSTRACT:
A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.
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Reid Jason S.
Viswanathan Nungavaram S.
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