Method for releasing a micromechanical structure

Details Method for releasing a micromechanical structure Method for releasing a micromechanical structure

2007-11-13

2007-11-13

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S099000, C216S024000

Reexamination Certificate

active

11081645

ABSTRACT:
A method for releasing a micromechanical structure. A substrate is provided. At least one micromechanical structural layer is provided above the substrate, wherein the micromechanical structural layer is sustained by a sacrificial layer of a silicon material. An amine-based etchant is provided to etch the silicon material. That is, during performing a post-cleaning procedure with an amine-based etchant, polymer residue and the sacrificial layer of silicon can be simultaneously removed without any additional etching processes.

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