Method for reducing particulate contamination during plasma proc

Details Method for reducing particulate contamination during plasma proc Method for reducing particulate contamination during plasma proc

1993-09-21

1995-06-13

Kastler, Scott

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 21, 134 37, B08B 600

Patent

active

054239184

ABSTRACT:
A technique for removing particles from above a semiconductor wafer, particularly particles that are trapped in a plasma chamber during processing of the wafer. Trapped particles are usually not all drawn out with gases exhausted from the chamber, in part because a peripheral focus ring and clamping mechanism impede their flow. In the method of the invention, the focus ring and clamping mechanism are raised on completion of processing, but before radio-frequency (rf) power is disconnected from the process chamber. Trapped particles are then easily flowed from the chamber with an introduced inert gas, and the level of particulate contamination of the wafer is significantly reduced.

REFERENCES:
patent: 5238532 (1993-08-01), Zarowin et al.
patent: 5252181 (1993-10-01), Dutartre et al.

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