Method for reducing particles on a substrate using chuck cleanin

Details Method for reducing particles on a substrate using chuck cleanin Method for reducing particles on a substrate using chuck cleanin

1997-01-31

1999-10-12

Utech, Benjamin

Semiconductor device manufacturing: process

Cleaning of reaction chamber

1341041, 134153, 134157, B08B 300, B08B 302, B08B 304

Patent

active

059666358

ABSTRACT:
Particles counts and concentrations are reduced from the backside of a substrate, such as a semiconductor wafer or flat panel display with the invention, to improve precision and uniformity in subsequent operations, including lithography operations. A semiconductor substrate is placed on a chuck (10) in a track system (30), such as a resist coater, a developer, or other form of spin coater. The substrate is processed accordingly to conventional practice and the substrate is removed. The chuck is then cleaned by dispensing a solvent, for example using EGMEA or PGMEA, through a dispense nozzle (38) of the system. Alternatively, or additionally, a brush (36) or sponge which is at least partially saturated with a solvent (39) is moved across the chuck to remove particles. The chuck cleaning can occur between every wafer, every wafer lot, or less periodically, such as between shifts, as the chuck particle accumulation dictates.

REFERENCES:
patent: Re31053 (1982-10-01), Firtion et al.
patent: 4518678 (1985-05-01), Allen
patent: 4788994 (1988-12-01), Shinbara
patent: 4855775 (1989-08-01), Matsuoka
patent: 4886728 (1989-12-01), Salamy et al.
patent: 5001084 (1991-03-01), Kawai et al.
patent: 5032217 (1991-07-01), Tanaka
patent: 5626675 (1997-05-01), Sakamoto et al.

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