Thermal measuring and testing – Thermal testing of a nonthermal quantity
Patent
1996-09-10
1998-05-05
Bennett, G. Bradley
Thermal measuring and testing
Thermal testing of a nonthermal quantity
374 57, G01N 2500
Patent
active
057465126
ABSTRACT:
The present invention relates to a method that reduces the thermal gradient at polymorphic transformation of polysilicon. The cooling rate of conventional furnaces is too rapid in currently used processes. The thermal process includes high stress from polymorphic transformation, which causes the peeling of a polysilicon film and microcracking of the quartz tube and wafer boat. The present invention suggests steps following of reducing cracks of polysilicon in a quartz tube and boat. At first, determines the temperature of polymorphic transformation of said quartz tube and boat. Next, reduces the temperature gradient during heating or cooling of said quartz tube and boat during said temperature of polysilicon transformation. Furthermore, the heating or cooling rates of the furnace is limited to the range of 0.1.degree.-2.degree. C./min to reduce the temperature gradient inside the furnace tube. Therefore, the thermal stress that is caused by the phase transition of the quartz is reduced by the invention and the particles and microcrack issues are also reduced by the invention.
REFERENCES:
patent: 3788135 (1974-01-01), Hammond, Jr.
patent: 3958176 (1976-05-01), Kraeutle
patent: 3981196 (1976-09-01), Zeuch et al.
patent: 4567849 (1986-02-01), Wan
patent: 4770542 (1988-09-01), Takagi et al.
Tseng Kuo-Shu
Yao Liang-Gi
Bennett G. Bradley
Vanguard International Semiconductor Corporation
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