Method for reducing argon diffusion from high density plasma...

Details Method for reducing argon diffusion from high density plasma... Method for reducing argon diffusion from high density plasma...

2007-11-20

2007-11-20

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Utilizing reflow

C438S597000, C438S623000, C438S624000, C438S687000, C438S688000, C438S695000, C438S710000, C438S760000, C438S763000, C438S784000, C257SE21279

Reexamination Certificate

active

11034952

ABSTRACT:
A two-step high density plasma-CVD process is described wherein the argon content in the film is controlled by using two different argon concentrations in the argon/silane/oxygen gas mixture used for generating the high density plasma. The first step deposition uses high argon concentration and low sputter etch-to-deposition (E/D) ratio. High E/D ratio maintains the gap openings without necking. In the second step, a lower argon concentration and lower E/D ratio are used. Since observed metal defects are caused by argon diffusion in the top 200-300 nm of the HDP-CVD film, by controlling argon concentration in the top part of the film (i.e. second step deposition) to a low value, a reduced number of metal defects are achieved.

REFERENCES:
patent: 6211040 (2001-04-01), Liu et al.
patent: 6268274 (2001-07-01), Wang et al.
patent: 6274514 (2001-08-01), Jang et al.
patent: 6319796 (2001-11-01), Laparra et al.
patent: 6365015 (2002-04-01), Shan et al.
patent: 6391781 (2002-05-01), Ozawa et al.
patent: 6479881 (2002-11-01), Wang et al.
patent: 6719885 (2004-04-01), Lin et al.

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