Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-03-28
2006-03-28
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S710000, C438S712000, C156S345420
Reexamination Certificate
active
07018929
ABSTRACT:
A method for in-situ reduction of volatile residual contamination on a semiconductor process wafer following a plasma etching process including providing an ambient controlled chamber for accepting transfer of a semiconductor process wafer under controlled ambient conditions following a plasma etching process; providing a heat exchange surface disposed with the ambient controlled chamber in heat exchange relationship with means for heating the heat exchange surface; transferring a semiconductor process wafer having volatile residual contamination under controlled ambient conditions to the ambient controlled chamber; mounting the semiconductor process wafer in heat exchange relationship with the heat exchange surface; and, heating in-situ the heat exchange surface for a time period to thereby heat the semiconductor process wafer to vaporize the volatile residual contamination on the semiconductor process wafer while simultaneously removing a resulting vapor from the ambient controlled chamber.
REFERENCES:
patent: 5397432 (1995-03-01), Konno et al.
patent: 6051286 (2000-04-01), Zhao et al.
patent: 6091060 (2000-07-01), Getchel et al.
patent: 6350699 (2002-02-01), Maa et al.
patent: 6635185 (2003-10-01), Demmin et al.
Chang Zhi-Yong
Chen Hung-Wen
Chen Yei-Ren
Wu Chi-How
Norton Nadine G.
Taiwan Semiconductor Manufacturing Co. Ltd
Tung & Assoc.
Umez-Eronini Lynette T.
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