Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-17
2006-10-17
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S618000, C438S665000, C438S666000, C438S669000, C438S128000
Reexamination Certificate
active
07122456
ABSTRACT:
An input output ring for a semiconductor device is disclosed that uses power buffers having widths that vary from the widths of the input and output buffers. In one embodiment, the pitches between bond pads are the same, in another embodiment the pitches between the bond pads can vary. In another embodiment, the number of bond pads is greater than the number of associated active buffer areas. By connecting two power bond pads to a common buffer the inductance associated with the buffer is reduced, thereby reducing the number of active buffers needed to be dedicated to providing power to the semiconductor device.
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Chung Harvest W. C.
Rosefield Peter L.
ATI Technologies Inc.
Fourson George
Pham Thanh V.
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