Method for reclaiming semiconductor package

Details Method for reclaiming semiconductor package Method for reclaiming semiconductor package

2008-06-30

2010-06-29

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

C257SE21532

Reexamination Certificate

active

07745234

ABSTRACT:
A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.

REFERENCES:
patent: 6002178 (1999-12-01), Lin
patent: 6249052 (2001-06-01), Lin
patent: 7569923 (2009-08-01), Meir

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