Method for recirculating high-temperature etching solution

Details Method for recirculating high-temperature etching solution Method for recirculating high-temperature etching solution

1989-09-26

1990-12-25

Cohan, Alan

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156662, 134108, 137 3, 137 88, C23F 100

Patent

active

049800175

ABSTRACT:
A method for recirculating a high-temperature etching solution according to the present invention comprises the steps of continuously removing, from a bath for etching a wafer for a semiconductor device, a portion of an etching solution contained in the etching bath, injecting a predetermined amount of pure water for adjusting the concentration of the etching solution into the removed etching solution, heating the resulting solution to a predetermined temperature, and recirculating the heated solution into the etching bath.

REFERENCES:
patent: 4017343 (1977-04-01), Haas
patent: 4479849 (1984-10-01), Frantzen
patent: 4710261 (1987-12-01), Dennis
patent: 4795497 (1989-01-01), McConnell

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