Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1997-05-08
2000-05-30
Dutton, Brian
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
G01R 3126, H01L 2166
Patent
active
060690178
ABSTRACT:
An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modulated light, within the probe assembly, having a predetermined wavelength and frequency of modulation, impinges upon the wafer. A sensor in the probe assembly measures the surface photovoltage induced by the modulated light. A computer then uses the induced surface photovoltage to determine various electrical characteristics of the wafer.
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Kamieniecki Emil
Ruzyllo Jerzy
Dutton Brian
QC Solutions, Inc.
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