Method for radiofrequency wave etching

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

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216 38, 216 58, 216 63, 216 67, 216 69, 216 70, 438105, 438706, 438710, 438720, 438735, 438964, H01L 21311

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060777877

ABSTRACT:
A method for selective controlled etching of a material particularly by sequentially switching between two (2) or more modes of radiofrequency waves and/or by distance from a source of the microwaves. The modes and/or distance are selected depending upon the surface of the material to be etched. The etching is rapidly conducted at 0.5 mtorr to 10 torr, preferably using microwave plasma etching.

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