Method for providing uniaxial load distribution for laminate...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S089110, C156S089120, C156S250000

Reexamination Certificate

active

07947143

ABSTRACT:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

REFERENCES:
patent: 2821747 (1955-07-01), Rossiter
patent: 4583352 (1986-04-01), Heron
patent: 5069120 (1991-12-01), Schneider
patent: 5468315 (1995-11-01), Okada et al.
patent: 6221193 (2001-04-01), Cassidy et al.
patent: 6406778 (2002-06-01), Natarajan et al.
patent: 6597058 (2003-07-01), Natarajan et al.
patent: 6607620 (2003-08-01), Knickerbocker et al.
patent: 6607780 (2003-08-01), Natarajan et al.
patent: 6626225 (2003-09-01), Kochberger
patent: 6627020 (2003-09-01), Natarajan et al.
patent: 6726984 (2004-04-01), Natarajan et al.
patent: 6790515 (2004-09-01), Knickerbocker et al.
patent: 2002/0092600 (2002-07-01), Natarajan et al.
patent: 2004/0003494 (2004-01-01), Asami et al.
patent: 2005/0046410 (2005-03-01), Fleischman et al.
patent: 2005/0214508 (2005-09-01), Natarajan
patent: 2007/0065647 (2007-03-01), Natarajan et al.
patent: 730251 (1995-01-01), None
patent: 8222474 (1996-08-01), None
patent: 8264947 (1996-10-01), None
patent: 9260844 (1997-10-01), None
patent: 10199749 (1998-07-01), None
patent: 10199749 (1998-09-01), None
patent: 2003158376 (2003-05-01), None
patent: 20040186290 (2004-07-01), None
patent: 2005056880 (2005-03-01), None
patent: 2005056880 (2005-03-01), None
patent: 2005294487 (2005-10-01), None
patent: 2005065936 (2005-07-01), None
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP7030251&F=0 Minoru et al. “Multilayered Ceramic Wiring Board and Manufacture Therof” Patent Abstract: JP7030251 Jan. 31, 1995, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP8222474&F=0 Takao et al., “Manufacture of Ceramic Electronic Component” Patent Abstract: JP8222474 Aug. 30, 1996, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP8264947&F=0 Makoto et al., “Manufacture of Multilayer Ceramic Board” Patent Abstract: JP8264947 Oct. 11, 1996, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP9260844&F=0 Hideaki et al., “Ceramic Multilayered Board Manufacturing Method” Patent Abstract: JP9260844 Oct. 3, 1997, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP10199749&F=0 Yoichi et al., “Method for Manufacturing Multilayer Ceramic Electronic Part” Patent Abstract: JP10199749, Oct. 3, 1997, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP2003158376&F=0 No Author Listed, “No Title Listed” Patent Abstract: JP2003158376, May 30, 2003, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP2004186290&F=0 Hiroyoshi et al., “Method for Manufacturing Laminated Ceramic Electronic Component” Patent Abstract: JP2004186290, Jul. 2, 2004, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP2005056880&F=0 Takahiro et al., “Method for Manufacturing Laminated Ceramic Electronic Part” Patent Abstract: JP2005056880, Mar. 3, 2005, 1p.
esp@cenet, [online]; [retrieved Apr. 16, 2008]; retrieved from the Internet http://v3.espacenet.com/textdoc?DB=EPODOC@IDX=JP2005294487&F=0 Kuniyasu et al., “Method for Manufacturing Laminated Electronic Component” Patent Abstract: JP200594487, Oct. 20, 2005, 1p.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for providing uniaxial load distribution for laminate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for providing uniaxial load distribution for laminate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for providing uniaxial load distribution for laminate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2621720

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.