Method for providing substantially waste-free chemical vapor dep

Details Method for providing substantially waste-free chemical vapor dep Method for providing substantially waste-free chemical vapor dep

1984-05-03

1985-12-03

Childs, S. L.

Coating processes

Electrical product produced

Welding electrode

427 82, 427 93, 4272481, 427255, 4272553, 427331, B05D 306

Patent

active

045565848

ABSTRACT:
A method is disclosed for providing substantially effluent-waste free vacuum chemical vapor deposition of thin-film on semiconductor substrates. A first comparatively low efficiency diffusion furnace deposits selected thin-film on the semiconductor substrates. A second comparatively high-efficiency diffusion furnace operative in response to the effluent-waste stream of the first diffusion furnace deposits substantially all of the effluent-waste on throw-away baffles.

REFERENCES:
patent: 3745043 (1973-07-01), Bradley
patent: 3900597 (1975-08-01), Chruma et al.
patent: 4421786 (1983-12-01), Mahajan et al.

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