Method for providing rotationally symmetric alignment marks...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure

Reexamination Certificate

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C257S797000

Reexamination Certificate

active

08039366

ABSTRACT:
A method and apparatus includes an integrated circuit device, and at least one alignment mark on the integrated circuit device, the alignment mark comprises a first coded region, a second coded region adjacent the first coded region, and a third coded region adjacent the second coded region, the second coded region located between the first coded region and the third coded region, and markings on the first coded region and the third coded region being identical.

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