Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-10-19
1984-08-21
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 148 15, 357 91, 427 531, H01L 21265, B23K 2700
Patent
active
044661797
ABSTRACT:
A method for forming a polysilicon thin film semiconductor device precursor, and the precursor, are disclosed, wherein the deposited thin film layer is scanned with a continuous wave laser in a first direction, and scanned a second time in a direction different from that of the first direction. The cross-scanning reduces the anisotropy of the thin film produced by the first scanning and apparently induces larger grain size in the recrystallized polysilicon.
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Lam et al., J. Electrochem. Soc., 128, (1981), 1981.
Stutz et al., Appl. Phys. Letts., 39, (1981), 498.
Applied Physics Letter, vol. 33, No. 8, Oct. 15, 1978, pp. 775-778.
Harris Corporation
Roy Upendra
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