Method for providing polysilicon thin films of improved uniformi

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 148 15, 357 91, 427 531, H01L 21265, B23K 2700

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active

044661797

ABSTRACT:
A method for forming a polysilicon thin film semiconductor device precursor, and the precursor, are disclosed, wherein the deposited thin film layer is scanned with a continuous wave laser in a first direction, and scanned a second time in a direction different from that of the first direction. The cross-scanning reduces the anisotropy of the thin film produced by the first scanning and apparently induces larger grain size in the recrystallized polysilicon.

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Stutz et al., Appl. Phys. Letts., 39, (1981), 498.
Applied Physics Letter, vol. 33, No. 8, Oct. 15, 1978, pp. 775-778.

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