Method for providing low cost wafers for use as substrates for i

Details Method for providing low cost wafers for use as substrates for i Method for providing low cost wafers for use as substrates for i

1977-12-27

1979-04-03

Esposito, Michael F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156603, 156613, 156614, 156DIG64, 427 86, 427 38, H01L 21203, H01L 21205

Patent

active

041475844

ABSTRACT:
The method of manufacture of the present invention provides a wafer that is better than a bulk monocrystalline silicon wafer and equivalent to silicon on sapphire (SOS) wafers for use as substrates for integrated circuits. The method comprises taking an inexpensive slab of silicon having <111> crystal orientation and by low pressure CVD, high pressure CVD, or plasma deposition techniques depositing a polycrystalline layer of sapphire on the <111> silicon base. The polycrystalline layer of sapphire is then annealed at an elevated temperature to form a monocrystalline layer having a <1101> orientation. A single crystalline layer of silicon having <111> crystal orientation is then epitaxially grown on the sapphire. The resultant multilayer wafer is equivalent in function and reliability to a silicon on sapphire wafer without the commensurate cost.

REFERENCES:
patent: 3476617 (1969-11-01), Robinson
patent: 3655439 (1972-04-01), Seiter
patent: 3796597 (1974-03-01), Porter et al.
Allison et al., Proc. of IEEE, vol. 57, No. 9, "Thin Film Si ... Applications", pp. 1490-1498 (1969).
D. J. Dunn, J. of Appl. Phys., "Elect. Prop. Si Films ... On Sapphire", vol. 38, No. 4 (1967), pp. 1909-1914.
Ajmera, J. Electrochemical Soc., Eff. ... on Silicon, Oct. 1972, pp. 1421-1424.

Affiliated with

Also associated with

Rating

Method for providing low cost wafers for use as substrates for i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for providing low cost wafers for use as substrates for i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for providing low cost wafers for use as substrates for i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1745403