Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-10-06
2000-05-16
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438460, 438612, 438613, H01L 2144, H01L 2148, H01L 2150
Patent
active
060636467
ABSTRACT:
The invention provides a method for producing semiconductor packages comprising the steps of forming electronic circuits for a plurality of semiconductor chips 11 on a wafer 1, forming bumps 2 on the plurality of semiconductor chips 11, encapsulating the circuit-forming surface 111 of the wafer 1 and the bumps 2 with a sealant by screen printing means to form a sealant layer 4, curing the sealant layer 4, grinding the surface of the sealant layer 4 until the upper end surface of the bump 2 becomes exposed, placing solder balls on said upper end surface of bumps 2 to weld the balls to the surface thereof, and dicing the wafer 1 and the sealant layer 4 as united into individual semiconductor chips 11. Screen printing means is used to encapsulate the entire surface of the wafer with a resin, so that the equipment costs can be markedly reduced as compared with conventional methods using a mold.
REFERENCES:
patent: 4600600 (1986-07-01), Pammon et al.
patent: 5620927 (1997-04-01), Lee
patent: 5849608 (1998-12-01), Abe
patent: 5851845 (1998-12-01), Wood et al.
Fujita Noriko
Hashimoto Tsunekazu
Ishikawa Yuki
Nagai Koichiro
Okuno Atsushi
Collins D. M.
Japan Rec Co., Ltd.
Picardat Kevin M.
LandOfFree
Method for production of semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for production of semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for production of semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-258208