Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
Corporate Assignee
active
No affiliations
Method for production of semiconductor package
Method of sealing electric parts mounted on electric wiring boar
LandOfFree
Japan Rec Co., Ltd. does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Japan Rec Co., Ltd., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Japan Rec Co., Ltd. will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-450234