Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1990-01-19
1991-05-14
Derrington, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
264 61, C04B 4182
Patent
active
050153145
ABSTRACT:
A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition.
The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.
REFERENCES:
patent: 4503090 (1985-03-01), Brown et al.
patent: 4504339 (1985-03-01), Kamehara et al.
patent: 4594181 (1986-06-01), Siuta
patent: 4679320 (1987-07-01), Imanaka et al.
patent: 4772346 (1988-09-01), Anderson
Kamehara Nobuo
Niwa Koichi
Ogawa Hiromi
Suzuki Hitoshi
Tsukada Mineharu
Derrington James
Fujitsu Limited
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