Method for producing via holes in polymer dielectrics

Details Method for producing via holes in polymer dielectrics Method for producing via holes in polymer dielectrics

1987-01-05

1988-08-16

Hearn, Brian E.

Fishing, trapping, and vermin destroying

156643, 156655, 156656, 1566591, 148DIG106, 148DIG91, 148DIG92, 148DIG93, 148DIG74, 21912165, 21912168, 21912167, 430317, 437173, 437928, 437935, 437203, C23F 102, B44C 122

Patent

active

047644850

ABSTRACT:
A method for producing a hole in a polymer film includes the steps of depositing a conductive layer onto the polymer film and irradiating a spot on the layer with a burst of focused laser energy at a level sufficient to form an opening in the film and, subsequently, plasma etching the film so as to form a hole of desired depth in the polymer film underlying the opening in the conductive layer. This method is particularly applicable to the formation of multichip intergrated circuit packages in which a plurality of chips formed in a semiconductor wafer are coated with a polymer film covering the chips and the substrates. The holes are provided for the purpose of interconnecting selected chip contact pads via a deposited conductive layer which overlies the film and fills the holes.

REFERENCES:
patent: 3193418 (1965-07-01), Cooper et al.
patent: 3920951 (1975-11-01), Chovan et al.
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4490210 (1984-12-01), Chen et al.
patent: 4503315 (1985-03-01), Kamioka et al.
patent: 4542037 (1985-09-01), Delfino
patent: 4665295 (1987-05-01), McDavid
Hodgsom, "Ohmic Contacts Made by Lasers", IBM TD13, vol. 12, No. 10, Mar. 1979, p. 4286.

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