Method for producing ultra-thin semiconductor device

Details Method for producing ultra-thin semiconductor device Method for producing ultra-thin semiconductor device

2007-01-02

2007-01-02

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S455000, C257SE21600

Reexamination Certificate

active

10680548

ABSTRACT:
A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor layer from a support substrate and thereby improve the productivity and quality. The method uses two porous peeling layers on opposite sides of a substrate to produce an ultra-thin substrate.

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