Method for producing titanium silicide

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438656, 438683, H01L 214763

Patent

active

06103620&

ABSTRACT:
A method for producing a titanium silicide. Titanium is deposited in a chamber in a reactive sputtering manner while flowing a mixture of argon gas and SiH.sub.4 or Si.sub.2 H.sub.6 into the chamber.

REFERENCES:
patent: 4218291 (1980-08-01), Fukuyama et al.
patent: 5278100 (1994-01-01), Doan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing titanium silicide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing titanium silicide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing titanium silicide will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2006336

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.