Method for producing thermally matched probe assembly

Details Method for producing thermally matched probe assembly Method for producing thermally matched probe assembly

2006-05-05

2009-06-16

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Shaping one-piece blank by removing material

C029S825000, C029S874000, C029S876000, C029S881000, C324S754090, C324S761010

Reexamination Certificate

active

07546670

ABSTRACT:
A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while still in wafer form, and throughout a range of temperatures. A guide plate and a contactor assembly for such use, comprising a substrate formed of a material having a coefficient of thermal expansion approximately equal to that of the device; and at least one hole in the guide plate for receiving an electrical contact (probe element) for contacting at least one respective region on said surface, said at least one hole being sized and shaped so as to accept said electrical contact, while allowing said electrical contact (probe element) to move with respect to said hole in said guide plate. The material can be one of silicon, borosilicate glass and cordierite.

REFERENCES:
patent: 6104596 (2000-08-01), Hausmann
patent: 6140828 (2000-10-01), Iino et al.
patent: 6642728 (2003-11-01), Kudo et al.
patent: 6768331 (2004-07-01), Longson et al.
patent: 2002/0179223 (2002-12-01), Boek et al.
patent: 2004/0088855 (2004-05-01), Akram

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