Method for producing solid-state imaging device

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430314, 430317, 430320, 430321, 430330, 2502081, G03F 726

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active

052866050

ABSTRACT:
In a method for producing a micro lens in a solid-state imaging device, a thermally stable transparent resin layer for forming a planar surface is deposited on a base layer of the solid-state imaging device, a far-ultraviolet sensitive thermoplastic layer is deposited on the transparent layer, a photosensitive resin layer sensitive to light of longer wavelength than the far-ultraviolet sensitive resin layer and highly absorbing far-ultraviolet light is deposited on the far-ultraviolet sensitive resin layer, portions of the photosensitive resin layer are removed, far-ultraviolet light irradiates the resin layers, portions of the far-ultraviolet sensitive resin layers are removed, and portions of the transparent layer are thermally deformed into a desired micro lens shape. Therefore, access to the bonding pad under the transparent resin film can be obtained after the deposition and patterning of the thermoplastic resin film wherein non-uniformities in the thermoplastic resin film are reduced, resulting is a micro lens having high light collection ability and no wavelength sensitivity variations.

REFERENCES:
patent: 4694185 (1987-09-01), Weiss
patent: 4732841 (1988-03-01), Radigan
Brunsvold et al, "Advanced Bilayer Resist Process With Optimized PMGI Formulation", SPIE, vol. 1086 Advances in Resist Technology and Processing VI (1989), pp. 289-299.

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