Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-03-09
2009-10-27
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000, C438S460000, C257SE25006, C257SE25013, C257SE25018, C257SE25021, C257SE25027
Reexamination Certificate
active
07608481
ABSTRACT:
A method for producing a semiconductor package including a main semiconductor chip having a semiconductor circuit formed on one surface thereof, at least one subsidiary semiconductor chip stacked on the other surface of the main semiconductor chip, and an encapsulation resin covering the subsidiary semiconductor chip. This method comprises a semiconductor wafer preparation step of preparing a semiconductor wafer, on whose one surface many rectangular regions are defined by streets, and in each of the rectangular regions of which a semiconductor circuit constituting the main semiconductor chip is disposed; a circular concavity formation step of forming a circular concavity in the other surface of the semiconductor wafer; a semiconductor chip stacking step of stacking at least one such subsidiary semiconductor chip on each of many rectangular regions on the bottom surface of the circular concavity; an encapsulation resin formation step of filling a molten resin into the circular concavity, and curing the resin, thereby forming an encapsulation resin covering the subsidiary semiconductor chips; and a separation step of cutting the encapsulation resin, together with the semiconductor wafer, along the streets, to separate the semiconductor wafer and the encapsulation resin into many of the semiconductor packages.
REFERENCES:
patent: 2006/0057776 (2006-03-01), Tao
patent: 2007/0007247 (2007-01-01), Sekiya
Disco Corporation
Smith , Gambrell & Russell, LLP
Zarneke David A
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