Method for producing semiconductor device

Details Method for producing semiconductor device Method for producing semiconductor device

1981-09-22

1983-03-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156653, 156657, 156345, 204192E, 252 791, 427 38, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

043774385

ABSTRACT:
A method for producing a semiconductor device has the steps of forming an insulating film on an uneven surface of a semiconductor body; and dry etching the insulating film by using as an etchant a gas containing carbon-halogen bonds and hydrogen, whereby the surface of said insulating film is smoothed.

REFERENCES:
patent: 3940506 (1976-02-01), Heinecke
patent: 4073054 (1978-02-01), Kaji
patent: 4222792 (1980-09-01), Lever et al.
Extended Abstracts of the Journal of Electrochemical Society, vol. 77-2, Oct. 1977, 366-377.
Heinecke, Solid State Electronics, vol. 18, No. 12, Dec. 1975, pp. 1146-47.
IBM Technical Disclosure Bulletin, vol. 20, No. 4 Sep. 1977, pp. 1381-82.

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