Method for producing polymer-free area on a substrate

Details Method for producing polymer-free area on a substrate Method for producing polymer-free area on a substrate

2006-04-11

2006-04-11

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S082000, C257S040000

Reexamination Certificate

active

07026186

ABSTRACT:
The invention relates to a method for producing a polymer-free area, characterized by applying at least one peelable layer to the substrate, and/or to one or more polymer layer(s) situated on the substrate, in those areas where a polymer-free area is formed on the substrate by removing the peelable layer. The invention thus provides a method for producing polymer-free bonding areas or, by placing a diode-protecting cap on the polymer-free area of the substrate, a hermetically sealed connection between the substrate and the diode-protecting cap.

REFERENCES:
patent: 11-307246 (1998-09-01), None
patent: 10-261486 (1999-11-01), None
patent: WO 01/18886 (2001-03-01), None
Vincken, Marianne , Phillips Journal of Research, vol. 51 No. 4, 1998, pp. 461, 463-465, 467-477, 479-493, 495-525, 527-533.

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