Method for producing nozzle arrays for ink jet printers

Details Method for producing nozzle arrays for ink jet printers Method for producing nozzle arrays for ink jet printers

1977-12-23

1979-06-12

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

96 36, 156647, 156654, 156659, 156662, H01L 21308

Patent

active

041579356

ABSTRACT:
Nozzle arrays for ink jet recording are produced by preferred chemical etching of a substrate material which frequently has a non-uniform thickness. The preferred substrate is a monocrystalline silicon wafer and the 100 plane surface of the wafer is coated with etchant masking material and the resist coated wafer is held in close physical contact with a base member. A suitable mask member which defines a nozzle array pattern is spaced a predetermined distance from the base member and is positioned parallel to the base member. The wafer is then exposed through the mask by a suitable light source arranged at a suitable angle while the wafer is simultaneously rotated about an axis perpendicular to the wafer. The wafer is then exposed to a chemical anisotropic etching agent to produce a uniform array of nozzles in the wafer wherein the lateral walls of the nozzles are substantially in the "111" plane of the wafer. The masking material is then stripped from the wafer.

REFERENCES:
patent: 2014513 (1935-09-01), Zimmerman
patent: 2463093 (1949-03-01), Felder
patent: 3373437 (1969-03-01), Sweet et al.
patent: 3632398 (1972-01-01), Konig
patent: 3856525 (1974-12-01), Inoue
patent: 3914050 (1975-10-01), Dost et al.
patent: 4007464 (1977-02-01), Bassous et al.
patent: 4066491 (1978-01-01), Ruh et al.
Bassous, "Fabrication . . . Dimensions," IBM Technical Disclosure Bull., vol. 20, No. 6, (Nov. 1977), pp. 2474-2479.
Bassous et al., "Fabrication . . . Nozzles," IBM Technical Disclosure Bull., vol. 17, No. 11, (Apr. 1975), pp. 3450-3452.

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