Method for producing multi-gate field-effect transistor with...

Semiconductor device manufacturing: process – Making regenerative-type switching device – Having field effect structure

Reexamination Certificate

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C438S157000, C257S336000, C257SE21437, C257SE21389, C257SE29261

Reexamination Certificate

active

07638370

ABSTRACT:
In a method for producing an electronic component, a first doped connection region and a second doped connection region are formed on or above a substrate; a body region is formed between the first doped connection region and the second doped connection region; at least two gate regions separate from one another are formed on or above the body region; at least one partial region of the body region is doped by means of introducing dopant atoms, wherein the dopant atoms are introduced into the at least one partial region of the body region through at least one intermediate region formed between the at least two separate gate regions.

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Jozef C. Mitros et al., “High-Voltage Drain Extended MOS Transistors for 0.18-μm Logic CMOS Process”, IEEE Transactions on Electron Devices, vol. 48, No. 8, Aug. 2001, pp. 1751-1755.
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