Method for producing micromechanic sensors and sensors...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C438S422000, C438S719000

Reexamination Certificate

active

07045382

ABSTRACT:
Proposed is a method for manufacturing micromechanical sensors and sensors manufactured by this method, where openings are introduced into a semiconductor substrate. After the openings are introduced into the semiconductor substrate, a subsequent temperature treatment is carried out, in which the openings are converted into voids in the depth of the substrate.

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Mizushima et al., Applied Physics Letter, vol. 77, No. 20, Nov. 13, 2000, p. 3290-2.
Mizushima et al., “Empty-Space-In-Silicon Technique For Fabricating A Silicon-On-Nothing Structure,” Nov. 13, 2000, pp. 3290-3292, vol. 77, No. 20, Applied Physics Letters.

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