Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-05-16
2006-05-16
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S422000, C438S719000
Reexamination Certificate
active
07045382
ABSTRACT:
Proposed is a method for manufacturing micromechanical sensors and sensors manufactured by this method, where openings are introduced into a semiconductor substrate. After the openings are introduced into the semiconductor substrate, a subsequent temperature treatment is carried out, in which the openings are converted into voids in the depth of the substrate.
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Mizushima et al., “Empty-Space-In-Silicon Technique For Fabricating A Silicon-On-Nothing Structure,” Nov. 13, 2000, pp. 3290-3292, vol. 77, No. 20, Applied Physics Letters.
Artmann Hans
Benzel Hubert
Schaefer Frank
Weber Heribert
Everhart Caridad
Kenyon & Kenyon LLP
Robert & Bosch GmbH
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