Method for producing metal silicide-silicon heterostructures

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156DIG100, 156DIG102, 156DIG103, 427 95, C30B 2514

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active

045540454

ABSTRACT:
Described is a method for producing semiconductor heterostructures incorporating a metal layer. The metal layer, typically a metal-silicide, can be produced by, e.g., co-deposition or reaction with the substrate. The resulting silicide is typically epitaxial and of high crystalline perfection.

REFERENCES:
patent: 3927225 (1975-12-01), Cordes et al.
patent: 3929527 (1975-12-01), Chang et al.
patent: 4180596 (1979-12-01), Crowder et al.
Epitaxial Growth of Nickel Silicide NiS.sub.2 on Silicon, Tu et al., Proc. 6th Internl. Vacuum Congr. 1974.

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