Method for producing insulating ring zones by galvanic and etch

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156634, 156656, 1566611, 204 15, 430 23, 430321, 430323, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044040601

ABSTRACT:
All surfaces of a plate having a select pattern of through-holes are coated with a thin metal layer, including the side walls of the through-holes. A layer of a negative dry resist is then laminated onto a plate surface adjacent and facing desired insulating ring zones in such a manner that a portion of the resist layer penetrates into the through-hole orifices. Subsequently, the resist layer portions within the orifices are irradiated with ultraviolet light directed through the through-holes from the surface thereof opposite that coated with the resist layer and then, optionally, another layer of dry resist is applied to this opposing plate surface. Thereafter the resist layer or layers on the plate are irradiated through an appropriate mask aligned relative to the through-hole pattern to define areas for electrodes and the non-irradiated resist areas are stripped-off with a developer. Subsequently, a metal layer is galvanically applied onto all uncovered metal surface areas, remaining resist areas are removed and the so-uncovered metal areas are etched away to define electrodes. The method is useful, for example, in producing elements for flat plasma picture screens.

REFERENCES:
patent: 3661581 (1972-05-01), Feldstein
patent: 4240869 (1980-12-01), Diepers
patent: 4342821 (1982-08-01), Galves et al.

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